SPICE Modeling and CMOS Circuit Development of a SiC Power IC Technology-Reference-Cited by-同舟云学术

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SPICE Modeling and CMOS Circuit Development of a SiC Power IC Technology

Published:2021-08-09 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)
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Author:

Liu Tianshi,Zhang Hua,Isukapati Sundar Babu,Ashik Emaran,Morgan Adam J.,Lee Bongmook,Sung Woongje,White Marvin H.,Fayed Ayman,Agarwal Anant K.

Funder

Advanced Research Projects Agency

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9531648/9531647/09531903.pdf?arnumber=9531903

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A 400 V Buck Converter integrated with Gate-Drivers and low-voltage Controller in a 25–600 V mixed-mode SiC CMOS technology;Analog Integrated Circuits and Signal Processing;2024-04-23

2. Automatic test-bench for SiC power devices using LabVIEW;Journal of Electrical Engineering;2024-04-01

3. A 600V Half-Bridge Power Stage Fully Integrated with 25V Gate-Drivers in SiC CMOS Technology;2022 IEEE 65th International Midwest Symposium on Circuits and Systems (MWSCAS);2022-08-07

4. SPICE Modeling and Circuit Demonstration of a SiC Power IC Technology;IEEE Journal of the Electron Devices Society;2022

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