Towards thermally-aware design of 3D MPSoCs with inter-tier cooling-Reference-Cited by-同舟云学术

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Towards thermally-aware design of 3D MPSoCs with inter-tier cooling

Published:2011-03 Issue: Volume: Page:
ISSN:
Container-title:2011 Design, Automation & Test in Europe
language:
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Author:

Sabry M M,Sridhar A,Atienza D,Temiz Y,Leblebici Y,Szczukiewicz S,Borhani N,Thome J R,Brunschwiler T,Michel B

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5754459/5762992/05763237.pdf?arnumber=5763237

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Power Supply Noise Aware Task Scheduling on Homogeneous 3D MPSoCs Considering the Thermal Constraint;Journal of Computer Science and Technology;2018-09

2. A new flow pattern-based boiling heat transfer model for micro-pin fin evaporators;International Journal of Heat and Mass Transfer;2018-07

3. Hydrodynamic and thermal analysis of a micro-pin fin evaporator for on-chip two-phase cooling of high density power micro-electronics;Applied Thermal Engineering;2018-02

4. Two-phase operational maps, pressure drop, and heat transfer for flow boiling of R236fa in a micro-pin fin evaporator;International Journal of Heat and Mass Transfer;2017-04

5. Modelling of the flow-rate dependent partial thermal resistance of integrated microscale cooling structures;Microsystem Technologies;2016-02-19

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