Author:
Falsetti C.,Jafarpoorchekab H.,Magnini M.,Borhani N.,Thome J.R.
Funder
Schweizerischer Nationalfonds zur Förderung der Wissenschaftlichen Forschung
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference38 articles.
1. Advanced Packaging Technology for Leading Edge Microelectronics and Flexible Electronics;Fillion,2011
2. M.M. Sabry, A. Sridhar, D. Atienza, Y. Temiz, Y. Leblebici, S. Szczukiewicz, N. Borhani, J.R. Thome, T. Brunschwiler, B. Michel, Towards thermally-aware design of 3D MPSoCs with inter-tier cooling, Design, Automation and Test in Europe Conference & Exhibition, 2011.
3. Reasons to use two-phase refrigerant cooling;Marcinichen;Electr. Cool,2011
4. Fundamental issues related to flow boiling in minichannels and microchannels;Kandlikar;Exp. Therm Fluid Sci.,2002
5. Convective boiling in parallel microchannels;Hetsroni;Microscale Thermophys. Eng.,2004
Cited by
36 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献