Chip-Package-Board codesign Methodology for Energy Harvesting DC-DC Boost Converters-Reference-Cited by-同舟云学术

Chip-Package-Board codesign Methodology for Energy Harvesting DC-DC Boost Converters

Published:2022-11-16 Issue: Volume: Page:
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Container-title:2022 37th Conference on Design of Circuits and Integrated Circuits (DCIS)
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Author:

Gogolou Vasiliki¹,Kozalakis Konstantinos¹,Noulis Thomas¹,Siskos Stylianos¹

Affiliation:

1. Aristotle University of Thessaloniki,Electronics Lab,Physics Department,Thessaloniki,Greece,54124

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9969904/9970010/09970047.pdf?arnumber=9970047

Reference24 articles.

1. Design Considerations for Very High Frequency dc-dc Converters

2. Basic Calculation of a Boost Converter's Power Stage;hauke;Texas Instruments Appl Rep Novemb,2009

3. Chip/Package/Board Co-Simulation Methodology for Crosstalk between DC/DC Converter and ADC Input Channels

4. The characterization and application of chip topside bonding materials for power modules packaging: a review

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