Chip/Package/Board Co-Simulation Methodology for Crosstalk between DC/DC Converter and ADC Input Channels-Reference-Cited by-同舟云学术

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Chip/Package/Board Co-Simulation Methodology for Crosstalk between DC/DC Converter and ADC Input Channels

Published:2018-09 Issue: Volume: Page:
ISSN:
Container-title:2018 7th Electronic System-Integration Technology Conference (ESTC)
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Author:

Settino Francesco,Brandtner Thomas,Subotskaya Volha,Levanto Antonio,Faricelli Marco,Praemassing Frank,Ricca Luca Della,Koffler Harald,Palestri Pierpaolo,Crupi Felice

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8520538/8546331/08546338.pdf?arnumber=8546338

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Chip-Package-Board codesign Methodology for Energy Harvesting DC-DC Boost Converters;2022 37th Conference on Design of Circuits and Integrated Circuits (DCIS);2022-11-16

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