Thermal properties of power HBT's
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx1/16/6384/00249461.pdf?arnumber=249461
Cited by 29 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Accurate and efficient analysis of the upward heat flow in InGaP/GaAs HBTs through an automated FEM‐based tool and Design of Experiments;International Journal of Numerical Modelling: Electronic Networks, Devices and Fields;2018-11-28
2. Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies;Microelectronics Reliability;2017-11
3. An efficient heat-spreader design: First demonstration on InGaP/graded InGaAs base/GaAs collector-up HBTs;Solid-State Electronics;2013-01
4. Enhanced Thermal Performance of InGaP/GaAs Collector-Up HBTs With a Miniaturized Backside Heat-Dissipation Structure;IEEE Transactions on Components, Packaging and Manufacturing Technology;2012-12
5. Proper-Orthogonal-Decomposition Based Thermal Modeling of Semiconductor Structures;IEEE Transactions on Electron Devices;2012-11
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