Accurate and efficient analysis of the upward heat flow in InGaP/GaAs HBTs through an automated FEM‐based tool and Design of Experiments-Reference-Cited by-同舟云学术

Accurate and efficient analysis of the upward heat flow in InGaP/GaAs HBTs through an automated FEM‐based tool and Design of Experiments

Published:2018-11-28 Issue:2 Volume:32 Page:e2530
ISSN:0894-3370
Container-title:International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
language:en
Short-container-title:Int J Numer Model

Author:

d'Alessandro Vincenzo¹^ORCID,Catalano Antonio Pio¹,Codecasa Lorenzo²,Zampardi Peter J.³,Moser Brian⁴

Affiliation:

1. Department of Electrical Engineering and Information TechnologyUniversity Federico II Naples Italy

2. Department of Electronics, Information, and BioengineeringPolitecnico di Milano Milan Italy

3. Qorvo, Inc. Newbury Park CA USA

4. Qorvo, Inc. Thorndike Rd. Greensboro NC USA

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Science Applications,Modeling and Simulation

Link

Reference54 articles.

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4. Improving the thermal ruggedness of GaAs HBTs through nonuniform base ballasting optimization;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27