Voltage Dependence of Single-Event Cross Sections of FinFET SRAMs for Low LET Condition
Author:
Affiliation:
1. Japan Aerospace Exploration Agency, Tsukuba, Ibaraki, Japan
2. Socionext Inc., Kawasaki, Kanagawa, Japan
3. National Institutes for Quantum Science and Technology, Takasaki, Gunma, Japan
Funder
Japan Aerospace Exploration Agency
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Nuclear Energy and Engineering,Nuclear and High Energy Physics
Link
http://xplorestaging.ieee.org/ielx7/23/10221199/10182270.pdf?arnumber=10182270
Reference14 articles.
1. TCAD in Selete
2. Moore’s law continues into the 1x-nm era;james;Proc 27th Annu SEMI Adv Semiconductor Manuf Conf (ASMC),2016
3. Characteristic Charge Collection Mechanism Observed in FinFET SRAM Cells
4. Scaling trends and bias dependence of the soft error rate of 16 nm and 7 nm FinFET SRAMs
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1. An SEU Cross Section Model Reproducing LET and Voltage Dependence in Bulk Planar and FinFET SRAMs;2024 IEEE International Reliability Physics Symposium (IRPS);2024-04-14
2. Mitigation of Single-Event Upset Sensitivity for 6T SRAM in a 0.18 μm DSOI technology Considering High LET Heavy Ions Irradiation;IEEE Transactions on Nuclear Science;2023
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