Cooling Codes: Thermal-Management Coding for High-Performance Interconnects-Reference-Cited by-同舟云学术

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Cooling Codes: Thermal-Management Coding for High-Performance Interconnects

Published:2018-04 Issue:4 Volume:64 Page:3062-3085
ISSN:0018-9448
Container-title:IEEE Transactions on Information Theory
language:
Short-container-title:IEEE Trans. Inform. Theory

Author:

Chee Yeow Meng^ORCID,Etzion Tuvi^ORCID,Kiah Han Mao^ORCID,Vardy Alexander^ORCID

Funder

Ministry of Education - Singapore

United States—Israel Binational Science Foundation (BSF), Jerusalem, Israel

BSF-NSF

Singapore Ministry of Education

United States—Israel BSF, Jerusalem, Israel

National Science Foundation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Library and Information Sciences,Computer Science Applications,Information Systems

Link

https://ieeexplore.ieee.org/ielaam/18/8318411/8101536-aam.pdf

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Combinatorial constructions of optimal low-power error-correcting cooling codes;Designs, Codes and Cryptography;2024-04-04

2. Thermal-Aware Channel Capacity;2023 IEEE International Symposium on Information Theory (ISIT);2023-06-25

3. Dimensions of Channel Coding: From Theory to Algorithms to Applications;IEEE Journal on Selected Areas in Information Theory;2023

4. Domination mappings into the hamming ball: Existence, constructions, and algorithms;Advances in Mathematics of Communications;2021

5. Endurance-Limited Memories: Capacity and Codes;IEEE Transactions on Information Theory;2021

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