3D monolithic integration-Reference-Cited by-同舟云学术

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3D monolithic integration

Published:2011-05 Issue: Volume: Page:
ISSN:
Container-title:2011 IEEE International Symposium of Circuits and Systems (ISCAS)
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Author:

Batude P.,Vinet M.,Pouydebasque A.,Le Royer C.,Previtali B.,Tabone C.,Hartmann J.-M.,Sanchez L.,Baud L.,Carron V.,Toffoli A.,Allain F.,Mazzocchi V.,Lafond D.,Deleonibus S.,Faynot O.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5910713/5937406/05938045.pdf?arnumber=5938045

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermo-Mechanical Reliability Analysis and Raman Spectroscopy Characterization of Sub-micron Through Silicon Vias (TSVs) for Backside Power Delivery in 3D Interconnects;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Investigation of the Electrical Coupling Effect for Monolithic 3-Dimensional Nonvolatile Memory Consisting of a Feedback Field-Effect Transistor Using TCAD;Micromachines;2023-09-23

3. Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09

4. Built-In Self-Test of High-Density and Realistic ILV Layouts in Monolithic 3-D ICs;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-03

5. An Investigation of the Effect of the Work-Function Variation of a Monolithic 3D Inverter Stacked with MOSFETs;Micromachines;2022-09-14

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