Localized substrate removal technique enabling strong-confinement microphotonics in bulk Si CMOS processes-Reference-Cited by-同舟云学术

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Localized substrate removal technique enabling strong-confinement microphotonics in bulk Si CMOS processes

Published:2008-05 Issue: Volume: Page:
ISSN:
Container-title:2008 Conference on Lasers and Electro-Optics
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Author:

Holzwarth Charles W.,Orcutt Jason S.,Hanqing Li ,Popovic Milos A.,Stojanovic Vladimir,Hoyt Judy L.,Ram Rajeev J.,Smith Henry I.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4560187/4571172/04571716.pdf?arnumber=4571716

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Polycrystalline silicon PhC cavities for CMOS on-chip integration;Scientific Reports;2022-10-12

2. Wet-Etched Three-Level Silicon Interposer for 3-D Embedding and Connecting of Optoelectronic Dies and CMOS ICs;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-04

3. SOI-based centimeter-scale Mach-Zehnder interferometers for fluid sensing;SPIE Proceedings;2017-02-22

4. Photonic Crystal Microcavities in a Microelectronics 45-nm SOI CMOS Technology;IEEE Photonics Technology Letters;2015-03-15

5. LumiNOC: A Power-Efficient, High-Performance, Photonic Network-on-Chip;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2014-06

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