Author:
Iadanza S.,Devarapu G. C. R.,Blake A.,Alba P. Acosta,Pedini J.-M.,O’Faolain L.
Abstract
AbstractIn this work, we present an on-chip 2D and 3D photonics integration solution compatible with Front End of Line integration (FEOL) using deposited polycrystalline silicon (poly:Si) for optical interconnects applications. Deposited silicon integration on a bulk silicon wafer is here discussed in all its processing steps and configurations. Moreover, results of deposited silicon high-Q Photonic Crystal (PhC) resonators are shown, demonstrating the possibility to employ optical resonators patterned on this material in the next generation of 2D and 3D integrated optical interconnects.
Funder
European Research Council
H2020 Future and Emerging Technologies
Science Foundation Ireland
Publisher
Springer Science and Business Media LLC
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