Author:
Kurita Yoichiro,Matsui Satoshi,Takahashi Nobuaki,Soejima Koji,Komuro Masahiro,Itou Makoto,Kakegawa Chika,Kawano Masaya,Egawa Yoshimi,Saeki Yoshihiro,Kikuchi Hidekazu,Kato Osamu,Yanagisawa Azusa,Mitsuhashi Toshiro,Ishino Masakazu,Shibata Kayoko,Uchiyama Shiro,Yamada Junji,Ikeda Hiroaki
Cited by
46 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Fan-Out Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
2. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
3. Benchmarking Frequency-Dependent Parasitics of Fine-Pitch Off-Chip I/Os for 2.5D and 3D Heterogeneous Integration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-12
4. Fan-Out Wafer/Panel-Level Packaging;Semiconductor Advanced Packaging;2021
5. Panel-Level Fan-Out RDL-First Packaging for Heterogeneous Integration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-07