Effect of Unfilled Underfills on Drop Impact Reliability Performance of Area Array Packages-Reference-Cited by-同舟云学术

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Effect of Unfilled Underfills on Drop Impact Reliability Performance of Area Array Packages

Published: Issue: Volume: Page:
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Container-title:56th Electronic Components and Technology Conference 2006
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Author:

Ibe E.S.,Loh K.I.,Jing-en Luan ,Tong Yan Tee

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/10951/34490/01645687.pdf?arnumber=1645687

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhancing Board-Level Drop Impact Reliability Through Epoxy-Based Underfill Modification;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07

2. Study on board-level reliability of passive components on ultra-high density PCB assemblies;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

3. Underfill Affect Study on Chip Stress in Board & Set Level Drop Test;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

4. Processing and Reliability of Solder Interconnections in Stacked Packaging;3D Microelectronic Packaging;2020-11-24

5. Ultra-Thin Package Board Level Drop Impact Modeling and Validation;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05

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