Author:
Syed Ahmer,Lin Wei,Sohn Eun-Sook,Cha Se-Woong
Cited by
16 articles.
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1. Effect of Bi on the Tensile and Viscoplastic Behavior of Sn-Ag-Cu-Bi Alloys Used for Microelectronics Applications;Metals;2024-07-09
2. Identification of Solder Joint Failure Modes Using Machine Learning;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-12
3. Solder Joint Technology;Handbook of Manufacturing Engineering and Technology;2014-09-30
4. Solder Joint Technology;Handbook of Manufacturing Engineering and Technology;2014
5. Drop-Shock Failure Prediction in Electronic Packages by Using Peridynamic Theory;IEEE Transactions on Components, Packaging and Manufacturing Technology;2012-03