Author:
Nai Sharon M. L.,Tan Long Bin,Selvanayagam Cheryl
Reference90 articles.
1. Abtew M, Selvaduray G (2000) Lead-free Solders in Microelectronics. Mater Sci Eng R Rep 27:95–141
2. Ahat S, Sheng M, Luo L (2001) Microstructure and shear strength evolution of SnAg/Cu surface mount solder joint during aging. J Electron Mater 30(10):1317–1322
3. Anand L (1985) Constitutive equations for hot-working of metals. Int J Plast 1(3):213–231
4. Babaghorbani P, Nai SML, Gupta M (2009) Development of lead-free Sn-3.5Ag/SnO2 nanocomposite solders. J Mater Sci Mater Electron 20:571–576
5. Bieler TR, Lee TK (2010) Lead-free solder. In: Jürgen Buschow KH, Cahn RW, Flemings MC, Ilschner B, Kramer EJ, Mahajan S, Veyssière P