Author:
Yong Liu ,Irving S.,Tumulak M.,Cabahug E.A.
Cited by
4 articles.
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1. A finite element simulation of PoP assembly processes;2010 11th International Conference on Electronic Packaging Technology & High Density Packaging;2010-08
2. Reusability-based selection of parametric finite element analysis models;Artificial Intelligence for Engineering Design, Analysis and Manufacturing;2009-02-11
3. Selection of Proper Fatigue Model for Flip Chip Package Reliability;Materials Science Forum;2005-12
4. Power cycling simulation of an IC package: considering electromigration and thermal-mechanical failure;53rd Electronic Components and Technology Conference, 2003. Proceedings.