The Rationale and Paradigm of "More than Moore"-Reference-Cited by-同舟云学术

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The Rationale and Paradigm of "More than Moore"

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Container-title:56th Electronic Components and Technology Conference 2006
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Author:

G.Q. Kouchi Zhang ,Graef M.,van Roosmalen F.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/10951/34490/01645639.pdf?arnumber=1645639

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability Analysis of Cu Sintered Die-Attach for SiC Power Devices: Mechanical, Electrical, and Thermal Evaluation;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Nanoindentation characterization of sintered porous Cu nanoparticles used in power electronics packaging – A molecular dynamic simulation study;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

3. Optimizing Hierarchical 3-D Floorplanning with simulated annealing Algorithm;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

4. A Thin-film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Bridging the gap: Perspectives of nanofabrication technologies for application-oriented research;Journal of Vacuum Science & Technology B;2021-12

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