A novel mechanical shock test method to evaluate lead-free BGA solder joint reliability
-
Published:
Issue:
Volume:
Page:
-
ISSN:
-
Container-title:Proceedings Electronic Components and Technology, 2005. ECTC '05.
-
language:
-
Short-container-title:
Author:
Reiff D.,Bradley E.
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献