An improved unified creep-plasticity model for SnAgCu solder under a wide range of strain rates
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s10853-017-0851-x.pdf
Reference43 articles.
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4. Long X, Wang Y, Keer LM, Yao Y (2016) Mechanical effects of isolated defects within a lead-free solder bump subjected to coupled thermal-electrical loading. J Micromech Mol Phys 1:1650004
5. Lau CS, Khor CY, Soares D, Teixeira JC, Abdullah MZ (2016) Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review. Solder Surf Mt Technol 28:41–62
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