C4NP technology: Manufacturability, yields and reliability
Author:
Affiliation:
1. IBM Systems & Technology Group (STG), 2070 Route 52, Hopewell Junction, N.Y.12533, USA
2. IBM Canada, 23 Blvd de L'Aeroport, Bromont QC J2L 1A3, Canada
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/4542565/4549927/04550197.pdf?arnumber=4550197
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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2. Development of Liquid Photoresist for IMS (Injection Molded Solder) with High Thermal Stability;Journal of Photopolymer Science and Technology;2016
3. Technology Trends: Past, Present, and Future;Advanced Flip Chip Packaging;2013
4. Flip-Chip Interconnections: Past, Present, and Future;Advanced Flip Chip Packaging;2013
5. Development of an 18 × 18 mm package-on-package using C4NP flip chip attach and back side grind;2010 Proceedings 60th Electronic Components and Technology Conference (ECTC);2010
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