Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159418.pdf?arnumber=9159418
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Flip Chip Joining with Injection Molded Solder Technology;2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2023-03-07
2. Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere;Journal of Materials Research and Technology;2022-11
3. Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
4. Thermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu Pillar;2022 International Conference on Electronics Packaging (ICEP);2022-05-11
5. High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF);Materials & Design;2021-08
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