Author:
Sauter W.,Aoki T.,Hisada T.,Miyai H.,Petrarea K.,Beaulied F.,Allard S.,Power J.,Agbesi M.
Cited by
13 articles.
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1. Test Structure for Evaluation of Pad Size for Wafer Probing;2023 35th International Conference on Microelectronic Test Structure (ICMTS);2023-03-27
2. Shear Force Classification Before Wire Bonding Based on Probe Mark 2-D Images Using Machine Learning Methods;IEEE Transactions on Semiconductor Manufacturing;2022-05
3. Structural characterization of semiconductor multi-layer pad;Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science;2021-07-19
4. Mechanical characterization and modeling of different pad structures;2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2020-07
5. Feature extraction of the wafer probe marks in IC packaging;2017 International Conference on Robotics and Machine Vision;2017-12-19