Author:
Motohashi N.,Kurita Y.,Soejima K.,Tsuchiya Y.,Kawano M.
Cited by
12 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Fan-Out Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
2. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
3. Fan-Out Wafer/Panel-Level Packaging;Semiconductor Advanced Packaging;2021
4. Panel-Level Fan-Out RDL-First Packaging for Heterogeneous Integration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-07
5. Fan-Out RDL-first Panel-Level Packaging for Heterogeneous Integration;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06