Impact of package design and materials on reliability for temperature cycling, bend, and drop loading conditions
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/4542565/4549927/04550168.pdf?arnumber=4550168
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2. Effect of Ag content on microstructure and mechanical properties of Sn−xAg−0.5Cu solder joints under rapid thermal shock;Transactions of Nonferrous Metals Society of China;2024-06
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4. Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study;2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2021-06-01
5. Comparison of Thermal Cycling Induced Mechanical Property Evolutions in Bulk Solder and Solder Joints;2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2021-06-01
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