Study of the mechanism of “smile” in high power diode laser arrays and strategies in improving near-field linearity-Reference-Cited by-同舟云学术

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Study of the mechanism of “smile” in high power diode laser arrays and strategies in improving near-field linearity

Published:2009-05 Issue: Volume: Page:
ISSN:
Container-title:2009 59th Electronic Components and Technology Conference
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Author:

Wang Jingwei,Yuan Zhenbang,Kang Lijun,Yang Kai,Zhang Yanxin,Liu Xingsheng

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5066986/5073977/05074109.pdf?arnumber=5074109

Cited by 30 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The SMILE Effect in the Beam Propagation Direction Affects the Beam Shaping of a Semiconductor Laser Bar Array;Photonics;2024-02-07

2. High Power conduction cooled annular diode laser stack packaged by gold-tin hard solder;Semiconductor Lasers and Applications XIII;2023-11-27

3. Method to reduce the smile of high-power diode laser bar by balancing the thermal-induced stress;Semiconductor Lasers and Applications XII;2022-12-27

4. Structural optimization of reducing the thermal stress and Smile in packaging a high-power diode laser array on a microchannel cooler using gold-tin hard solder;Semiconductor Lasers and Applications XI;2021-10-09

5. Kilowatt line beam from a 905nm pulsed diode laser module for LiDAR applications;Semiconductor Lasers and Applications X;2020-10-10

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