High Power conduction cooled annular diode laser stack packaged by gold-tin hard solder-Reference-Cited by-同舟云学术

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High Power conduction cooled annular diode laser stack packaged by gold-tin hard solder

Published:2023-11-27 Issue: Volume: Page:
ISSN:
Container-title:Semiconductor Lasers and Applications XIII
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Author:

Wang Jingwei,Zheng Yanfang,Han Yang,Fu Tuanwei,Hou Dong,Liu Xingsheng

Publisher

SPIE

Reference10 articles.

1. High Power Diode Lasers: Technology and Applications];Konstantin,2007

2. Packaging of high power semiconductor lasers;Xingsheng,2014

3. Complete Indiumfree CW 200W Passively Cooled High Power Diode Laser Array Using Double-side Cooling Technology;Jingwei,2017

4. Development of high power annular diode laser array using hard solder;Dong,2019

5. Light source components and semiconductor lasers;Jingwei;China Patent pending,2023

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