Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints-Reference-Cited by-同舟云学术

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Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

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Container-title:56th Electronic Components and Technology Conference 2006
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Author:

Bieler T.R.,Jiang H.,Lehman L.P.,Kirkpatrick T.,Cotts E.J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/10951/34490/01645849.pdf?arnumber=1645849

Cited by 59 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of Sn grain growth in solder joints by numerical simulations;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15

2. Correlative, ML-based and non-destructive 3D-analysis of intergranular fatigue cracking in SAC305-Bi solder balls;npj Materials Degradation;2024-04-20

3. Correlative, ML based and non destructive 3D analysis of intergranular fatigue cracking in SAC305 Bi solder balls;2024-01-23

4. Insights Into the Grain Orientation Effect on Electromigration-Induced Failure in Solder Interconnects Through Phase Field Modeling;IEEE Transactions on Electron Devices;2024-01

5. Modeling the Microstructure of Polycrystalline Sn–Ag–Cu Solders;Advanced Structured Materials;2024

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