Multichip self-assembly technique on flexible polymeric substrate-Reference-Cited by-同舟云学术

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Multichip self-assembly technique on flexible polymeric substrate

Published:2008-05 Issue: Volume: Page:
ISSN:
Container-title:2008 58th Electronic Components and Technology Conference
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Author:

Fukushima T.,Konno T.,Tanaka T.,Koyanagi M.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4542565/4549927/04550179.pdf?arnumber=4550179

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research of Chip Placement Accuracy for Fan-Out WLP Using A Novel Self-Assembly Stage;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11

2. Room-Temperature Cu Direct Bonding Technology Enabling 3D Integration with Micro-LEDs;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. A Novel Chip Placement Technlogy for Fan-Out WLP using Self-Assembly Technique with Porous Chuck Table;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

4. Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly;2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2020-04

5. A Novel Pick-Up and Place Process for FO-WLP Using Tape Expansion Machine Device;2017 IEEE 67th Electronic Components and Technology Conference (ECTC);2017-05

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