A Novel Pick-Up and Place Process for FO-WLP Using Tape Expansion Machine Device
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7998598/7999654/07999717.pdf?arnumber=7999717
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Research of Chip Placement Accuracy for Fan-Out WLP Using A Novel Self-Assembly Stage;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11
2. Advanced Assembly Technology for Small Chip Size of Fan-out WLP using High Expansion Tape;2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT);2022-10-19
3. A Novel Chip Placement Technlogy for Fan-Out WLP using Self-Assembly Technique with Porous Chuck Table;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06
4. High Expansion Tape for Fan-Out WLP Applying a Novel Stress-Strain Curve Measuring Method;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
5. Latest Fan-Out Wafer Level Packaging Technologies for Realizing System Integration and Its Future Prospects;Journal of Japan Institute of Electronics Packaging;2018
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