Board level drop test reliability of IC packages-Reference-Cited by-同舟云学术

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Board level drop test reliability of IC packages

Published: Issue: Volume: Page:
ISSN:
Container-title:Proceedings Electronic Components and Technology, 2005. ECTC '05.
language:
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Author:

Chai T.C.,Quek S.,Hnin W.Y.,Wong E.H.,Chia J.,Wang Y.Y.,Tan Y.M.,Lim C.T.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/9844/31024/01441335.pdf?arnumber=1441335

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability Improvement of Electronic Components: Influence of Design Parameters on Fatigue Life;2023 Smart Systems Integration Conference and Exhibition (SSI);2023-03-28

2. Humidity and corrosion susceptibility of molded packages under mechanical impact Novel package level impact test to provoke micro-damage;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25

3. Dynamic response of electronic materials to impact loading: review;ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik;2017-01-12

4. Board level drop test: exact solution to the problem of the nonlinear dynamic response of a PCB to the drop impact;Journal of Materials Science: Materials in Electronics;2016-05-20

5. The mechanics of the solder ball shear test and the effect of shear rate;Materials Science and Engineering: A;2006-02

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