3D sequential integration: applications and associated key enabling modules (design & technology)
Author:
Batude P.1, Billoint O.1, Thuries S.1, Malinge P.2, Fenouillet-Beranger C.1, Peizerat A.1, Sicard G.1, Vivet P.1, Reboh S.1, Cavalcante C.1, Brunet L.1, Ribotta M.1, Brevard L.1, Garros X.1, Frutuoso T. Mota1, Sklenard B.1, Lacord J.1, Kanyandekwe J.1, Kerdiles S.1, Sideris P.1, Theodorou C.3, Lapras V.1, Mouhdach M.1, Gaudin G.4, Besnard G.4, Radu I.4, Ponthenier F.1, Farcy A.2, Jesse E.2, Guyader F.2, Matheret T.1, Brunet P.1, Milesi F.1, Van-Jodin L. Le1, Sarrazin A.1, Perrin B.1, Moulin C.1, Maitrejean S.1, Alepidis M.3, Ionica I.3, Cristoloveanu S.3, Gaillard F.1, Vinet M.1, Andrieu F.1, Arcamone J.1, Ollier E.1
Affiliation:
1. Université Grenoble Alpes,CEA-Leti 2. ST Microelectronics 3. Univ. Grenoble Alpes, Univ. Savoie Mont Blanc, CNRS, Grenoble INP, IMEP-LAHC. 4. SOITEC
Cited by
3 articles.
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