Thermal Integrity of ReRAM-based Near-Memory Computing in 3D Integrated DNN Accelerators
Author:
Affiliation:
1. Stony Brook University (SUNY), Stony Brook,Department of Electrical and Computer Engineering,New York,11794
2. Air Force Research Laboratory,Rome,New York,13441
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10256666/10256705/10256927.pdf?arnumber=10256927
Reference27 articles.
1. Impact of Temperature on the Resistive Switching Behavior of Embedded $\hbox{HfO}_{2}$-Based RRAM Devices
2. Resistive Random Access Memory (RRAM): an Overview of Materials, Switching Mechanism, Performance, Multilevel Cell (mlc) Storage, Modeling, and Applications
3. Temperature-Aware Optimization of Monolithic 3D Deep Neural Network Accelerators
4. THOR: THermal-aware Optimizations for extending ReRAM Lifetime
5. Power and Thermal Modeling of In-3D-Memory Computing
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