Power and Thermal Modeling of In-3D-Memory Computing-Reference-Cited by-同舟云学术

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Power and Thermal Modeling of In-3D-Memory Computing

Published:2021-03-03 Issue: Volume: Page:
ISSN:
Container-title:2021 International Symposium on Devices, Circuits and Systems (ISDCS)
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Author:

Han Jun-Han,West Robert E.,Torres-Castro Karina,Swami Nathan,Khan Samira,Stan Mircea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9397888/9397889/09397913.pdf?arnumber=9397913

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Simulation of ML Applications on a Commercial DRAM-Based PIM;2024 International Technical Conference on Circuits/Systems, Computers, and Communications (ITC-CSCC);2024-07-02

2. Modeling the Thermal Characteristics of Stacked 2T0C Memory Array Based on InGaZnO₄ Thin-Film Transistors;IEEE Transactions on Electron Devices;2023-12

3. Time-domain Subtractive Readout Scheme for Scalable Capacitive Analog In-Memory Computing;2023 IEEE 36th International System-on-Chip Conference (SOCC);2023-09-05

4. Thermal Integrity of ReRAM-based Near-Memory Computing in 3D Integrated DNN Accelerators;2023 IEEE 36th International System-on-Chip Conference (SOCC);2023-09-05

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