Author:
Jourdain A.,Rottenberg X.,Carchon G.,Tilmans H.A.C.
Cited by
4 articles.
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2. Packaging;Reference Module in Materials Science and Materials Engineering;2016
3. MEMS packaging process by film transfer using an anti-adhesive layer;Microsystem Technologies;2010-01-21
4. Direct Hybrid Bonding;Integrated Circuits and Systems;2008