Author:
Han Jun-Han,Torres-Castro Karina,West Robert E.,Varhue Walter,Swami Nathan,Stan Mircea
Cited by
4 articles.
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1. Hot-LEGO: Architect Microfluidic Cooling Equipped 3DIC with Pre-RTL Thermal Simulation;Proceedings of the 14th International Green and Sustainable Computing Conference;2023-10-28
2. From 2.5D to 3D Chiplet Systems: Investigation of Thermal Implications with HotSpot 7.0;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
3. Thermal Analysis of Microfluidic cooling in Processing-in-3D-Stacked Memory;2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2021-04-19
4. A 1000× Improvement of the Processor-Memory Gap;The Frontiers Collection;2020