Author:
Han Jun-Han,Torres-Castro Karina,West Robert E.,Varhue Walter,Swami Nathan,Stan Mircea
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. From 2.5D to 3D Chiplet Systems: Investigation of Thermal Implications with HotSpot 7.0;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
2. Thermal Analysis of Microfluidic cooling in Processing-in-3D-Stacked Memory;2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2021-04-19
3. A 1000× Improvement of the Processor-Memory Gap;The Frontiers Collection;2020