Thermal Analysis of Microfluidic cooling in Processing-in-3D-Stacked Memory-Reference-Cited by-同舟云学术

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Thermal Analysis of Microfluidic cooling in Processing-in-3D-Stacked Memory

Published:2021-04-19 Issue: Volume: Page:
ISSN:
Container-title:2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Han Jun-Han,Torres-Castro Karina,West Robert E.,Swami Nathan,Stan Mircea

Funder

Semiconductor Research Corporation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9410808/9410806/09410836.pdf?arnumber=9410836

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Simulation of ML Applications on a Commercial DRAM-Based PIM;2024 International Technical Conference on Circuits/Systems, Computers, and Communications (ITC-CSCC);2024-07-02

2. Enhancement of flow boiling heat transfer in a phase separation structure under electric field;International Journal of Heat and Mass Transfer;2024-04

3. Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure;ACM Transactions on Embedded Computing Systems;2023-11-09

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