Dynamic VTH Tracking for Cross-Temperature Suppression in 3D-TLC NAND Flash-Reference-Cited by-同舟云学术

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Dynamic VTH Tracking for Cross-Temperature Suppression in 3D-TLC NAND Flash

Published:2019-10 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE International Integrated Reliability Workshop (IIRW)
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Author:

Zambelli Cristian,Ferro Enrico,Crippa Luca,Micheloni Rino,Olivo Piero

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8976314/8989871/08989886.pdf?arnumber=8989886

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An Adaptive Read Control Voltage Scheme for Reliability Enhancement of Flash-Based In-Memory Computing Architecture for Neural Network;IEEE Transactions on Device and Materials Reliability;2024-09

2. Exploring Cross-Temperature Reliability in 3D NAND Through Layer-Dependent Bit Error Analysis;2024 IEEE 8th International Test Conference India (ITC India);2024-07-21

3. Random Flip Bit Aware Reading for Improving High-Density 3-D NAND Flash Performance;IEEE Transactions on Circuits and Systems I: Regular Papers;2024-05

4. Cross-Temperature Reliability of 3D NAND: Cell-to-Cell Variability Analysis and Countermeasure;2024 IEEE International Reliability Physics Symposium (IRPS);2024-04-14

5. Computational Storage for 3D NAND Flash Error Recovery Flow Prediction;Lecture Notes in Electrical Engineering;2023-11-29

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