Author:
Kondou Ryuichi,Wang Chenxi,Suga Tadatomo
Cited by
12 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effects of argon plasma pretreatment of Si wafers on Si-Si bonding based on Mo/Au interlayers;Surface Topography: Metrology and Properties;2023-05-22
2. Recent Advances and Trends in Cu–Cu Hybrid Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-03
3. Cu-Cu Hybrid Bonding;Chiplet Design and Heterogeneous Integration Packaging;2023
4. Hybrid Bonding;Semiconductor Advanced Packaging;2021
5. Flip Chip Technology Versus FOWLP;Fan-Out Wafer-Level Packaging;2018