Funder
Advanced Semiconductor Engineering
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
2 articles.
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1. Modeling the cure shrinkage–induced warpage of epoxy molding compound;International Journal of Mechanical Sciences;2024-04
2. An Improved Mold Flow Optimization Technology for High-Density Power Modules;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10