3-D Die Stacking With 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System-Reference-Cited by-同舟云学术

3-D Die Stacking With 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System

Published:2021-05 Issue:5 Volume:11 Page:875-878
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Sakuma Katsuyuki^ORCID,Farooq Mukta,Andry Paul,Cabral Cyril^ORCID,Wassick Thomas,McHerron Dale,Divakaruni Rama

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

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