Ruggedness Characterization of Bonding Wire Arrays in LDMOSFET-Based Power Amplifiers-Reference-Cited by-同舟云学术

Ruggedness Characterization of Bonding Wire Arrays in LDMOSFET-Based Power Amplifiers

Published:2018-06 Issue:6 Volume:8 Page:1032-1041
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Lin Liang,Hua Yu-Jie,Zhou Liang^ORCID,Wu Qi,Mao Junfa^ORCID,Yin Wen-Yan^ORCID

Funder

NSFC

NSAF

Shanghai Science and Technology Commission

Science Challenge Project

Alexander von Humboldt Research Fellowship of Germany

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

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