Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip-Reference-Cited by-同舟云学术

Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip

Published:2022-06 Issue:6 Volume:12 Page:893-901
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Yi Hengqian¹^ORCID,Ozturk Efe²^ORCID,Koelink Marco³^ORCID,Krimmling Jana²,Damian Andrei A.⁴,Debski Wojciech¹,van Zeijl H. W.¹,Zhang Guoqi¹^ORCID,Poelma Rene H.¹

Affiliation:

1. Department of Microelectronics, Delft University of Technology, Delft, AA, The Netherlands

2. Silicon Radar GmbH, Frankfurt (Oder), Germany

3. Chip Integration Technology Center (CITC), Novio Tech Campus, Nijmegen, AT, The Netherlands

4. NXP, Nijmegen, AE, The Netherlands

Funder

Dutch National Funding Nederlandse Organisatie voor Wetenschappelijk Onderzoek (NWO), in TTW Section

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9805411/09795927.pdf?arnumber=9795927

Reference35 articles.

1. Material Properties of Poly(Propylene Carbonates)

2. An Integrated 122-GHz Antenna Array With Wire Bond Compensation for SMT Radar Sensors

3. Shrinkage of SU-8 microstructures during carbonization

4. Radar CFAR Thresholding in Clutter and Multiple Target Situations

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Wide Bandwidth Vivaldi Antenna Suitable for 5G/6G Communication Utilizing a CMOS 0.18 μm Process;Telecom;2024-05-14

2. A Compact RF Front-End SiP With Improved Harmonic Suppression for Dual Polarization Phased Array Radar;IEEE Microwave and Wireless Technology Letters;2024-03

3. Probe-Based Antenna Measurements at Sub-THz Frequencies;2023 Asia-Pacific Microwave Conference (APMC);2023-12-05

4. An integrated 60 GHz differential-fed patch array antenna in low-cost QFN package;Microelectronics Journal;2023-07

5. Low-temperature reliability enhancement of system-in-package with silicon-based resistors and its electrothermal analysis;Microelectronics Reliability;2023-06