SiC Microchannel Heat Sinks for High Heat Flux Dissipation of 1 kW/cm<sup>2</sup>-Reference-Cited by-同舟云学术

SiC Microchannel Heat Sinks for High Heat Flux Dissipation of 1 kW/cm²

Published:2023-05 Issue:5 Volume:13 Page:655-665
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Cassada Nicole¹^ORCID,Anderson Caleb¹^ORCID,Kubicek London¹,Hobby David¹,Frye Clint²,Baxamusa Salmaan²^ORCID,Kotovsky Jack²,Jackson Kathy²,Ladner Ian²,Bandhauer Todd¹

Affiliation:

1. Department of Mechanical Engineering, Colorado State University, Fort Collins, CO, USA

2. Lawrence Livermore National Laboratory, Livermore, CA, USA

Funder

U.S. Department of Energy through the Lawrence Livermore National Laboratory

Lawrence Livermore National Laboratory through the Laboratory Directed Research and Development (LDRD) Program

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

https://ieeexplore.ieee.org/ielam/5503870/10175659/10139789-aam.pdf

Reference22 articles.

1. High-performance heat sinking for VLSI

2. Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink

3. High Heat Flux Boiling Heat Transfer for Laser Diode Arrays

4. Computational examination of two-phase microchannel heat transfer correlations with conjugate heat spreading

5. Water-Based Microchannel and Galinstan-Based Minichannel Cooling Beyond 1 kW/cm $^{2}$ Heat Flux

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