Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs-Reference-Cited by-同舟云学术

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Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs

Published:2023-03 Issue:3 Volume:13 Page:300-314
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Agnesina Anthony¹^ORCID,Brunion Moritz²^ORCID,Kim Jinwoo¹^ORCID,Garcia-Ortiz Alberto²^ORCID,Milojevic Dragomir³,Catthoor Francky³^ORCID,Mirabelli Gioele³^ORCID,Komalan Manu³^ORCID,Lim Sung Kyu¹

Affiliation:

1. School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA

2. Institute of Electrodynamics and Microelectronics, University of Bremen, Bremen, Germany

3. IMEC, Leuven, Belgium

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/10115315/10093790.pdf?arnumber=10093790

Reference30 articles.

1. An algebraic expression to count the number of chips on a wafer

2. Investigation of Gross Die Per Wafer Formulas

3. Macro-3D: A Physical Design Methodology for Face-to-Face-Stacked Heterogeneous 3D ICs

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. System technology co-optimization for advanced integration;Nature Reviews Electrical Engineering;2024-09-02

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