Author:
Bamberg Lennart,Garcia-Ortiz Alberto,Zhu Lingjun,Pentapati Sai,Shim Da Eun,Kyu Lim Sung
Cited by
29 articles.
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1. On Legalization of Die Bonding Bumps and Pads for 3-D ICs;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2024-09
2. Comprehensive Physical Design Flow Incorporating 3-D Connections for Monolithic 3-D ICs;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2024-07
3. 3D integration of 2D electronics;Nature Reviews Electrical Engineering;2024-04-25
4. Routing-aware Legal Hybrid Bonding Terminal Assignment for 3D Face-to-Face Stacked ICs;Proceedings of the 2024 International Symposium on Physical Design;2024-03-12
5. Heterogeneous Monolithic 3-D IC Designs: Challenges, EDA Solutions, and Power, Performance, Cost Tradeoffs;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2024-03