Large-Area Bonding by Sintering of a Resin-Free Nanosilver Paste at Ultralow Temperature of 180 °C-Reference-Cited by-同舟云学术

Large-Area Bonding by Sintering of a Resin-Free Nanosilver Paste at Ultralow Temperature of 180 °C

Published:2022-04 Issue:4 Volume:12 Page:707-710
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Chen Shi¹^ORCID,Mei Yun-Hui²^ORCID,Wang Meiyu³,Li Xin¹^ORCID,Lu Guo-Quan⁴^ORCID

Affiliation:

1. School of Materials Science and Engineering, Tianjin University, Tianjin, China

2. School of Electrical Engineering, Tiangong University, Tianjin, China

3. College of Electronic Information and Optical Engineering, Nankai University, Tianjin, China

4. The Bradley Department of Electrical and Computer Engineering, Center for Power Electronics Systems (CPES), Virginia Tech, Blacksburg, VA, USA

Funder

National Natural Science Foundation of China

Tianjin Municipal Science and Technology Bureau

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference15 articles.

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