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Phase-Field Study of Thermomigration in 3-D IC Micro Interconnects

  • Published:2020-09 Issue:9 Volume:10 Page:1466-1473
  • ISSN:2156-3950
  • Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
  • language:
  • Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Attari VahidORCID,Arroyave Raymundo

Funder

Lawrence Livermore National Laboratory under Collaborative Research and Development in Support of LLNL Missions

NSF

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The role of Sn grain orientation in Cu depletion of Sn-based solders;Modelling and Simulation in Materials Science and Engineering;2024-07-05

2. Multi-parameters optimization for electromigration in WLCSP solder bumps;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

3. Seed Layer Etching, Thermal Reflow and Bonding of Cu-Sn Micro Bumps with $5\ \mu \mathrm{m}$ Diameters;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. Phase field modelling combined with data-driven approach to unravel the orientation influenced growth of interfacial Cu6Sn5 intermetallics under electric current stressing;Surfaces and Interfaces;2023-04

5. Preferential growth of intermetallics under temperature gradient at Cu–Sn interface during transient liquid phase bonding: insights from phase field simulation;Journal of Materials Research and Technology;2022-07
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