A Novel Conformal Thick Oxide Technology for On-Chip High-Voltage Isolation-Reference-Cited by-同舟云学术

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A Novel Conformal Thick Oxide Technology for On-Chip High-Voltage Isolation

Published:2022-04 Issue:4 Volume:12 Page:704-706
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Lv Guangfu¹^ORCID,Ding Yixiao²^ORCID,Fang Xiangming³,Li Lisong³,Bai Feiming¹^ORCID,Sin Johnny K. O.²^ORCID,Wu Rongxiang¹^ORCID

Affiliation:

1. State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China

2. Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology, Hong Kong

3. CoilEasy Technologies, Company, Ltd., Chongqing, China

Funder

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/9765761/09738610.pdf?arnumber=9738610

Reference7 articles.

1. Poly-Crystalline Silicon Waveguide Devices on Hollow Deep Trench Isolation in Standard Foundry Bulk Silicon Process

2. 200 V Enhancement-Mode p-GaN HEMTs Fabricated on 200 mm GaN-on-SOI With Trench Isolation for Monolithic Integration

3. Design and Characterization of the Deep-Trench, U-Shaped Field-Plate Edge Termination for 1200-V-Class SiC Devices

4. A Novel Double-Side Silicon-Embedded Transformer for 10-MHz, 1-kV-Isolation, Compact Power Transfer Applications

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