Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz-Reference-Cited by-同舟云学术

Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz

Published:2018-07 Issue:7 Volume:8 Page:1231-1240
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Curran Brian¹^ORCID,Reyes Jacob¹^ORCID,Tschoban Christian¹,Hofer Jan¹,Grams Arian¹,Wust Felix¹,Hutter Matthias¹,Leib Jens²,Martinez-Vazquez Marta²,Baggen Rens²,Ndip Ivan¹,Lang Klaus-Dieter¹

Affiliation:

1. Fraunhofer Institute of Reliability and Microintegration, Berlin, Germany

2. IMST GmbH, Kamp-Lintfort, Germany

Funder

Germany Aerospace

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/8410948/08392770.pdf?arnumber=8392770

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